![]() ![]() Again, most of this boils down to designing the right PCB stackup. EMI is essentially a reciprocal process if you design your board to have strong EMI immunity, then it will emit less EMI. The study of solving EMI problems is extensive, both at the IC level and the high speed PCB design level. You can read more about high speed PCB stackup design later in this guide. However, transient PDN ripple and any resulting EMI can be reduced significantly through proper stackup design and decoupling measures. This is another set of unavoidable problems in any design.
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